Sales of Bergers thermal materials Sil-Pad 800

PRODUCT DESCRIPTION：

High Performance Insulator for Low-Pressure Applications

FEATURES AND BENEFITS:

Thermal impedance: 0.45°C-in2/W (@50 psi)

High value material

Smooth and highly compliant surface

Electrically isolating

TYPICAL PROERTIES OF SIL-PAD 800:

Color: Gold

Reinforcement Carrier: Fiberglass

Thickness (inch) / (mm):5mil（0.127mm）

Hardness (Shore A):91

Elongation (% at 45º to Warp and Fill):20

Continuous Use Temp (°F) / (°C):-60℃~180℃

Dielectric Breakdown Voltage (Vac)：6000

Dielectric Constant (1000 Hz)：6.0

Volume Resistivity (Ohm-meter)：10¹⁰

Flame Rating：V-O

Thermal Conductivity (W/m-K)：1.6

Material advantages:

Sil-Pad® 800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.

Sil-Pad® 800 material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.

Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but

apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad® 800 minimizes interfacial thermal resistance and maximizes thermal performance.

TYPICAL APPLICATIONS INCLUDE

Power supplies

Automotive electronics

Motor controls

Power semiconductors

CONFIGURATIONS AVAILABLE

Sheet form, die-cut parts and roll form

With or without pressure sensitive adhesive